chipflow.packaging.grid_array

Grid array package definitions.

This module provides package definitions for grid array packages like BGA (Ball Grid Array) and PGA (Pin Grid Array) types.

Classes

GAPin

Pin identifier for grid array packages (row letter, column number)

GALayout

Layout type for grid array packages

GAPackageDef

Definition of a grid array package.

Module Contents

class chipflow.packaging.grid_array.GAPin

Bases: NamedTuple

Pin identifier for grid array packages (row letter, column number)

class chipflow.packaging.grid_array.GALayout

Bases: enum.StrEnum

Layout type for grid array packages

class chipflow.packaging.grid_array.GAPackageDef

Bases: chipflow.packaging.base.BasePackageDef[GAPin]

Definition of a grid array package.

Pins or pads are arranged in a regular array of ‘width’ by ‘height’. Pins are identified by a 2-tuple of (row, column), counting from the bottom left when looking at the underside of the package. Rows are identified by letter (A-Z), columns by number.

The grid may be complete or have missing pins (e.g., center cutout).

This includes many package types:

  • CPGA: Ceramic Pin Grid Array

  • OPGA: Organic Pin Grid Array

  • SPGA: Staggered Pin Grid Array

  • CABGA: Chip Array Ball Grid Array

  • CBGA/PBGA: Ceramic/Plastic Ball Grid Array

  • CTBGA: Thin Chip Array Ball Grid Array

  • CVBGA: Very Thin Chip Array Ball Grid Array

  • DSBGA: Die-Size Ball Grid Array

  • FBGA: Fine Ball Grid Array / Fine Pitch Ball Grid Array

  • FCmBGA: Flip Chip Molded Ball Grid Array

  • LBGA: Low-Profile Ball Grid Array

  • LFBGA: Low-Profile Fine-Pitch Ball Grid Array

  • MBGA: Micro Ball Grid Array

  • MCM-PBGA: Multi-Chip Module Plastic Ball Grid Array

  • nFBGA: New Fine Ball Grid Array

  • SuperBGA (SBGA): Super Ball Grid Array

  • TABGA: Tape Array BGA

  • TBGA: Thin BGA

  • TEPBGA: Thermally Enhanced Plastic Ball Grid Array

  • TFBGA: Thin and Fine Ball Grid Array

  • UFBGA/UBGA: Ultra Fine Ball Grid Array

  • VFBGA: Very Fine Pitch Ball Grid Array

  • WFBGA: Very Very Thin Profile Fine Pitch Ball Grid Array

  • wWLB: Embedded Wafer Level Ball Grid Array

Attributes:

  • width – Number of columns

  • height – Number of rows

  • layout_type – Pin layout configuration

  • channel_width – For PERIMETER/CHANNEL/ISLAND layouts

  • island_width – For ISLAND layout, size of center island

  • missing_pins – Specific pins to exclude (overrides layout)

  • additional_pins – Specific pins to add (overrides layout)

model_post_init(__context)

Initialize pin ordering

property bringup_pins: chipflow.packaging.pins.BringupPins

Bringup pins for grid array package

Return type:

chipflow.packaging.pins.BringupPins

property heartbeat: Dict[int, GAPin]

Numbered set of heartbeat pins for the package

Return type:

Dict[int, GAPin]